Aloe Semiconductor is poised to present an optical communication module capable of 850-Gb/s per fiber pair at the Optical Fiber Communication (OFC) Conference in San Francisco. This demonstration underscores a pivotal technological stride in optical networking, leveraging dual polarization (DP) and bi-directional (BiDi) technologies to enhance fiber capacity significantly. The module's innovation lies in its ability to quadruple the capacity of existing fiber without the need for new silicon infrastructure, addressing pressing challenges in network scalability.
The module's design incorporates a single-chip silicon-photonic integrated circuit (PIC) that houses both transmitter and receiver components. It employs two wavelengths—1271 nm and 1311 nm—for bi-directional transmission, alongside a Broadcom Sian 2 digital-signal processor equipped with integrated modulators and a transimpedance amplifier. This technical setup not only showcases the module's advanced capabilities but also its potential to revolutionize optical communication networks.
Christopher Doerr, CEO of Aloe Semiconductor, highlighted the module's future potential, suggesting that advancements could lead to achieving 1.6T per fiber pair with 200-Gbaud technology. This projection emphasizes the module's role in pushing the envelope of optical communication performance through the integration of polarization multiplexing and density-improvement technologies.
Dirk Lutz of Eoptolink, a collaborator in this endeavor, pointed out the DP-PAM4 technology's role as a novel method to augment short-reach fiber capacity without necessitating a complete silicon redesign. This approach is particularly relevant in today's optical networking landscape, where the limitations of optical escape and cabling density are becoming increasingly apparent.
Aloe Semiconductor's breakthrough is a testament to the company's leadership in optical communication innovation. By offering a solution that enhances efficiency and performance, the company is setting the stage for the development of more compact and high-performance networking infrastructure. For more information on the technology, visit https://www.example.com.
